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Brand Name : HUASWIN
Model Number : HSRFPC1003
Certification : ISO/UL/RoHS
Place of Origin : China
MOQ : 1 sets
Price : Negotiation
Payment Terms : T/T, Western Union, L/C
Supply Ability : 10,000pcs per month
Delivery Time : 15-20 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
1 Layer 2 Layer PI Rigid Flex PCB Printed Circuit Board Manufacturing
2 layer Rigid+1 layer PI Rigid Flex Printed Circuit Board With 0.12/0.12mm Minimum Width/Spacing
Huaswin Electronics Co., Limited is a professional PCB and PCBA manufacturer founded in 2000 year.
We supply a comprehensive suit of one-stop manufacturing service: Bare PCB fabrication, components sourcing, Automatic SMT / through hole PCB assembly, to programming, all testing, product packing, shipping.
PCB Capability:
1. Rigid PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid Flex PCB (up to 10 layers)
4 Aluminum based PCB
PCBA capability:
1. Material Sourcing Service
2. SMD assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly ( which including plastics, metal box, Coil, cable inside etc)
6. Packing design
Our advanced equipment, process flows in SMT, DIP assembly and high Standard Operation Procedure (SOP) are the fundamental assurance of providing high quality assembly service. The excellent soldering skills to our experienced employee on the production line, and the comfortable clean working environment ensures the quality of our strong processing capacity.
All of our products are produced under strictly observation of the ISO9001: 2000 and conform to the ROHS standard. We always take customer's satisfaction as our principle pursuit, " Good quality with reasonable price", "Quick delivery".
We sincerely look forward to establishing business relationship with esteemed you in near future.
Detailed Specification of Flexible PCB Manufacturing
 
| Technical Specification | ||
| Layers: | 1~10 (flex Pcb) and 2~8 (rigid flex) | 
 | 
| Min Panel Size: | 5mm x 8mm | 
 | 
| Max Panel Size: | 250 x 520mm | 
 | 
| Min Finished board thickness: | 0.05mm (1 sided inclusive copper) | 
 | 
| Max Finished board thickness: | 0.3mm (2 sided inclusive copper) | 
 | 
| Finished board thickness tolerance: | ±0.02~0.03mm | 
 | 
| Material: | Kapton, Polyimide, PET | 
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| Base copper thickness (RA or ED): | 1/3 oz, 1/2 oz, 1oz, 2oz | 
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| Base PI thickness: | 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil | 
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| Stiffner: | Polyimide, PET, FR4, SUS | 
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| Min Finished hole diameter: | Φ 0.15mm | 
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| Max Finished hole diameter: | Φ 6.30mm | 
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| Finished hole diameter tolerance (PTH): | ±2 mil ( ±0.050mm) | 
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| Finished hole diameter tolerance (NPTH): | ±1 mil ( ±0.025mm) | 
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| Min width/spacing (1/3oz): | 0.05mm/0.06mm | 
 | 
| Min width/spacing (1/2oz): | 0.06mm/0.07mm | 
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| Min width/spacing (1oz): | Single layer: 0.07mm/0.08mm | 
 | 
| Double layer: 0.08mm/0.09mm | 
 | |
| Aspect Ratio | 6:01 | 8:01 | 
| Base Copper | 1/3Oz--2Oz | 3 Oz for Prototype | 
| Size Tolerance | Conductor Width:±10% | W ≤0.5mm | 
| Hole Size: ±0.05mm | H ≤1.5mm | |
| Hole Registration: ±0.050mm | 
 | |
| Outline Tolerance:±0.075mm | L ≤50mm | |
| Surface Treatment | ENIG: 0.025um - 3um | 
 | 
| OSP: | 
 | |
| Immersion Tin: 0.04-1.5um | 
 | |
| Dielectric Strength | AC500V | 
 | 
| Solder Float | 288℃/10s | IPC Standard | 
| Peeling Strength | 1.0kgf/cm | IPC-TM-650 | 
| Flammability | 94V-O | UL94 | 
 
 
Quotation Requirement :
 
1) Following specifications are needed for quotation:
a) Base material 
b) Board thickness:
c) Copper thickness
d) Surface treatment: 
e) color of solder mask and silkscreen:
f) Quantity
 
 
Shiping method:
 
1) By DHL, Fedex, UPS, TNT etc.
2) By sea if it is possible
3) By air
 
 
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